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H2312XXLR3 + 4x HNS2600BPB 8 x INTEL XEON GOLD 6126 12 CORE 2.60GHZ 2048GB RAM
Marke:
INTEL
|
Numer produktu: H2312XXLR3_4
Opis
Intel® Server Chassis H2312XXLR3 + 4x nodes Intel® Compute Module HNS2600BPB
CPU: 8 x INTEL XEON GOLD 6126 CPU PROCESSOR 12 CORE 2.60GHZ ( 2x in each node )
RAM: 2048GB RAM ( 512GB in each node )
including rails kit, cables, 12 x caddys
Specification
Intel® Server Chassis H2312XXLR3
DESIGNED FOR
Intel Xeon Scalable Processors
Power up your business with Intel Xeon Scalable processors. With advanced performance, reliability, and security features, you can trust your business-critical workloads to the world's most powerful server processors.
RELIABLE DELIVERY
Packaged Securely
Your product will arrive packaged carefully, according to internal standards of item protection. The item is handled professionally; you can be sure that your order will arrive in perfect condition.
ALWAYS ON TIME
With Our Own Logistics
Thanks to our own fleet of vehicles, we are able to ensure fast and reliable delivery of very large goods, such as complete server systems and data centers. We offer individual service and full control over the transport of your goods. Trust us to take care of your transport needs and deliver your products on time within Europe
| Product Collection | Intel® Server Chassis H2000P Family |
| Chassis Form Factor | 2U, 4 node Rack Chassis |
| Chassis Dimensions | 3.46" x 17.24" x 30.35" |
| Power Supply | 2130 W |
| Backplanes | Included |
| Included Items | (1) Front Control Panels - iPC FH2000FPANEL2(1) Power Distribution Board - iPC FXXCRPSPDB2(2) 2130W 80 Plus Platinum PSUs – iPC FXX2130PCRPS(1) 12 x 3.5’’ Hot-swap drive bay, includes:- (12) Tool less drive carriers, iPC - TBD- (1) 12x3.5” Hot swap backplane, iPC- FHW12X35HS12G(4) - Compute Module Bay Fillers(1) - Basic rack rail mount kit (AXXELVRAIL)NOTE: The rail kit only supports specific rack type with 3/8” square and 7.1mm round holes. |
| Max CPU Configuration | 8 |
Intel® Compute Module HNS2600BPB
A hot-pluggable high-density compute module integrated with the Intel® Server Board S2600BPB for large memory capability and flexible configuration options for the Intel® Server Chassis H2312XXLR3.
| Product Collection | Intel® Server System S2600BPR Family |
| Compatible Product Series | Intel® Xeon® Scalable Processors |
| Supported Operating Systems | Windows Server 2016*, Windows Server 2012 R2*, Red Hat Enterprise Linux 7.3*, SUSE Linux Enterprise Server 12 SP2*, CentOS 7.3* |
| Board Form Factor | Custom 6.8" x 19.1" |
| Socket | Socket P |
| TDP | 165 W |
| Included Items | (1) 1U node tray(1) Intel® Server Board S2600BPB(1) Power Docking Board FHWBPNPB(3) 40x56mm dual rotor managed fans FXX4056DRFAN2(1) 1U passive Rear heat sink – CPU #1 – CuAL – FXXHP78X108HS(1) 1U passive heat sink – CPU #2 – AL – FXXEA78X108HS(1) Air duct(1) External VGA port bracket(1) Slot 1 riser card(1) Slot 2 riser card w/80mm M.2 SSD slot. Required Items – Sold Separately:One (1) bridge board option - AHWBPBGB, AHWBP12GBGB, AHWBP12GBGBR5 OR AHWBP12GBGBIT; One or two Intel® Xeon® processor Scalable family,Up to Sixteen (16) DDR4 RDIMM/LRDIMM |
| Board Chipset | Intel® C621 Chipset |
| Memory Specifications | |
| Max Memory Size (dependent on memory type) | 1.46 TB |
| Memory Types | DDR4 ECC RDIMM/LRDIMM 2133/2400/2666 |
| Max # of Memory Channels | 12 |
| Max # of DIMMs | 16 |
| ECC Memory Supported | Yes |
| Processor Graphics | |
| Integrated Graphics ‡ | No |
| Graphics Output | VGA |
| I/O Specifications | |
| # of USB Ports / USB Revision | 2 / 3.0 |
| Total # of SATA Ports | 4 |
| RAID Configuration | RAID Levels 0/1/10/5/50 (LSI) |
| # of Serial Ports | 1 |
| # of LAN Ports | 2 |
| Integrated LAN | 2x 10GbE; 1x 1GbE (Dedicated Management) |
| Package Specifications | |
| Max CPU Configuration | 2 |
| Advanced Technologies | |
| Intel® Optane™ Memory Supported ‡ | Yes |
| Intel® Virtualization Technology for Directed I/O (VT-d) ‡ | Yes |
| Intel® Remote Management Module Support | Yes |
| Intel® Node Manager | Yes |
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